Fully Automatic Backside Grinding

Product Description:

Thin processing of wafers with the thickness of less than 25μm can be carried out stably by the integrated Wafer Thinning machine with the high integration of back grinding and stress release.

Product Features:

1. Non-contact on-line measurement system to measure wafer thickness, effectively improve the measurement accuracy of wafer thickness;

2. The charge aggregation layer is obtained by texture process to improve the flexural strength of ultra-thin chip

3. Built-in WCS wafer cleaning system;

4. Independently developed spindle to effectively shorten the processing time of thin wafer;

5, the configuration of touch LCD and graphical user interface, more convenient for daily equipment operation and maintenance operations

6, the design structure is compact, covers an area of small, effective use of production workshop space.